引线框，（双列直插式）焊接框架，铅框架

引线框；引脚框架

bed frame───基架

headframe───n.[矿业]井架

metal frame───金属框架

bedframe───n.床架

cold frame───n.保护幼苗的玻璃罩；阳畦

headframes───n.[矿业]井架

lead time───n.提前期；订货至交货的时间；研制周期；交付周期

COB type LED has the lower thermal resistance than lead frame . Metal substrate appropriate power package.───COB型LED有 较支架低的热阻系数. 是照明用LED最合适之封装结构.

The heavy gauge lead frame is made of oxygen - free copper.───大尺寸引脚框由无氧铜制成.

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.───粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

The punching process of the lead frame was analyzed, the multi - position progressive die was designed.───分析了引线框的冲压工艺性, 设计出了 多工位 级进模.

punching process of the lead frame was analyzed, the multi-position progressive die was designed.───分析了引线框的冲压工艺性，设计出了多工位级进模。

Principle and methods of local spot plating lead frame were briefly introduced.───简单介绍了局部电镀技术的原理及方法.

punching process of the lead frame was analyzed, the multi-position progressive die was designed. and the technology points of die design and manufacture were introduced in detail.───分析了引线框的冲压工艺性，设计出了多工位级进模。并详细介绍了模具设计制造的技术要领。

COB type LED has the lower thermal resistance than lead frame . Metal substrate appropriate power package.

The single-sided fish defects of KFC copper alloys applied to lead frame produced by domestic corporation were studied and analyzed by energy spectrum analysis, SEM and metallographic analysis.

The copperbased lead frame materials currently used in intergrated circuit and the features of the new developed high strength high conductive copperbased materials are reviewed.

The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation .

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.