[机]焊线；接地线；[电]等电位连接线

接合线，焊线

fencing wire───电围栏导线

binding screw───接线螺旋；夹紧螺钉；紧固螺钉

blinding side───没有防范的一面；弱点

fencing wires───围栏铁丝

rounding file───[机]圆锉；废纸篓

sounding line───测深索

bidding war───竞价战；投标战

The third bonding wire is electrically connected between the second chip and the loader.───第三焊线电性连接于第二芯片与承载器之间。

The RF characteristics of bonding wire interconnection in a simple package model were simulated.───针对一种用键合线连接的简单封装模型进行射频性能的模拟。

It may be collocated with automatic correction device and ultrasonic strip. bonding wire and so on.───该机可配置自动纠偏装置和超声波插条, 焊线冲孔供用户自主选择.

content and focus of the project is based on the research and analysis of the present condition of internal and external golden bonding wire production.───在对国内外的键合金丝生产及研究现状进行详细分析与研究之后，确立了项目的研究内容并提出了项目的预期目标。

Reducing the first bond heel crack is the most important in improving the tensile strength of bonding wire in automatic wedge bonding.

It may be collocated with automatic correction device and ultrasonic strip. bonding wire and so on.

To eliminate the defective secondary junction caused by the deposition of additive element oxides in a high-purity gold bonding wire.

The second bonding wire is electrically connected between the relay circuit base board and the loader.

The first bonding wire is electrically connected between the first chip and the relay circuit base board.

Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.